SW-CCD-24 V-Shape Lens Microfiber Swab

Product Overview

The SW-822BS is a pointed tip precision polyester swab with a knitted polyester fiber head with bonded and sealed edge construction, built for high-precision cleaning tasks in semiconductor manufacturing, precision instrument maintenance, and optical component servicing environments where both pointed-tip access to narrow target areas and zero-fiber-shedding edge integrity are simultaneously required. It shares the core head geometry of the SW-822B — 11.5mm in length, 3.3mm in width, and 3.3mm in thickness with a pointed tip profile — but the "BS" designation indicates an upgraded construction standard: the head edges are sealed using a bonding and sealing process that locks the polyester fiber perimeter to prevent fiber release from the head margin during cleaning contact on rough surfaces, in connector recesses, and against component lead edges where the lateral drag force on the swab tip is greatest.

The pointed tip geometry provides precision access to electronic component pin gaps, bond pad arrays, optical lens edge features, fiber optic connector end-faces, and instrument channel interiors where flat or wide-head swabs make contact with surrounding structures before reaching the cleaning target. The 3.3mm square cross-section behind the tip provides adequate fiber volume for moderate liquid absorption and retention, making the swab suitable for both dry particulate cleaning and solvent-assisted residue removal without the drip risk that higher-absorption wide-head swabs present in fine-pitch component environments.

Bonded Sealed Edge Construction & Fiber Integrity

The bonded sealed edge construction addresses the specific contamination failure mode of pointed polyester swab tips: as the tip contacts and drags against substrate edges, component leads, and connector walls during cleaning, the perimeter fibers at the tip and head sides are subject to concentrated lateral peel forces that gradually loosen edge fibers in standard unsealed polyester heads. These loosened fibers shed onto cleaned surfaces — particularly into connector recesses and onto bond pad areas — where they are invisible to the naked eye but detectable as contamination during downstream electrical testing and optical inspection. The sealed edge eliminates this shedding pathway, ensuring that no fiber residue is deposited on cleaned semiconductor substrates, optical surfaces, or precision instrument contact points regardless of the cleaning pressure and direction applied.

The knitted polyester material is chemically resistant to IPA, ketone-based solvents, and common electronics cleaning formulations, maintaining low NVR performance after solvent contact and evaporation. The polypropylene handle measures 73mm in total length with 2.6mm width and thickness. Package contains 100 pieces in small packs, 500 pieces in large packs.

Industry Applications & Use Scenarios

The SW-822BS is used in semiconductor manufacturing, PCB assembly and rework, precision optical instrument cleaning, fiber optic component maintenance, and high-cleanliness electronics servicing where fiber shedding from the swab tip is a traceable defect source in the production process. Specific application scenarios include cleaning bond pad arrays on semiconductor packages before wire bonding where fiber contamination causes bonding failures, removing flux residue from fine-pitch BGA component footprints during PCB rework, cleaning fiber optic connector end-faces before insertion loss measurement where fiber deposits on the ferrule face increase insertion loss, accessing pin gaps in high-density connector assemblies during electronics maintenance, and performing cleaning operations in ISO Class 5–6 semiconductor cleanroom environments where particle counts at the workstation are actively monitored and fiber generation from cleaning tools is a tracked contamination source. The sealed edge construction makes it the precision-application upgrade from the SW-822B for workflows where fiber shedding control has been identified as a process requirement.